MSFM www.vishay.com vishay electro-films revision: 26-jan-15 1 document number: 61096 for technical questions, contact: efi@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 thin film, top-contact miniature resistor product may not be to scale the MSFM series of single-val ue precision resistors chips offer a small size, wide ohmi c value range and high power rating. the MSFM tantalum nitride resistor material offers excellent resistance to high moisture environments. the MSFMs are manufactured using vishay electro-films (efi) sophisticated thin-film eq uipment and manufacturing technology. the MSFMs are 100 % electrically tested and visually inspected to mil-std-883, method 2032, class h or k. features ? wire bondable ? small size: 0.015 " square ? case: 0101 ? wide value range: 2.5 ? to 400 k ? ? dc power rating up to 125 mw ? self passivating tantalum nitride film ? oxidized silicon substrate ? material categorization: fo r definitions of compliance please see www.vishay.com/doc?99912 applications vishay efi MSFM top-contact 0. 015" square resistor chips are designed for hybrid (chip an d wire) assemblies. they are ideally suited for compact desi gns due to their ultra small form factor. ? temperature coefficient of resistance, values, and tolerances parameter value unit total resistance range 2.5 to 400k ? standard tolerances 0.1, 0.5, 1 % tcr 25, 50, 100, 250 ppm/c standard electrical specifications parameter value unit noise, mil-std-202, method 308 ? > 100 ? ? < 100 ? -35 -20 db moisture resistance , mil-std-202 method 106 0.5 max. ? r / r % stability, 1000 h, +70 c, 125 mw 0.5 max. ? r / r % operating temperature range -55 to + 125 c thermal shock, mil-std-202, method 107, test condition f 0.2 max. ? r / r % high temperature exposure, +150 c, 100 h 0.5 max. ? r / r % dielectric voltage breakdown 200 v insulation resistance 10 12 min. ? operating voltage 100 max. v dc power rating up to +70 c ? (linear de-erated to zero at +175 c) 0.125 w 5x rated power short- time overload, +25 c, 5 s 0.25 max. ? r / r % 2.5 30 400 k 0.1 % tightest s tandard available tolerance and tcr 50 ppm/c 250 ppm/c 100 ppm/c 25 ppm/c 10 100 1 % 0.5 %
MSFM www.vishay.com vishay electro-films revision: 26-jan-15 2 document number: 61096 for technical questions, contact: efi@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 dimensions in inches power derating curve mechanical specifications parameter value chip size 0.015" x 0.015" 0.002" (0.381 mm x 0.381 mm 0.05 mm) chip thickness 0.010" 0.002" (0.254 mm 0.05 mm) chip substrate material oxidized silicon, 10 k? minimum oxide resistor material tantalum nitride, self-passivating bonding pad size 0.004" x 0.004" (0.1 mm x 0.1 mm) number of pads 2 pad material 10 k? minimum aluminum (au optional) backing none, lapped silicon global part number information glo b al part num b er: MSFM10001fkanhws glo b al part num b er description: MSFM 10k 1 %, 100 ppm/c, al, no b ack metal, class h, ws model resistance resistance multiplier code tolerance code (%) tcr (ppm/c) termination back metal visual class packaging code MSFM 15 x 15 size ta2n on silicon first 4 digits are significant figures of resistance c = 0.001 b = 0.01 a = 0.1 0 = 1 1 = 10 2 = 100 3 = 1000 b = 0.1 c = 0.25 d = 0.5 f = 1.0 g = 2.0 h = 2.5 j = 5.0 k = 10.0 e = 25 c = 50 k = 100 m = 250 g = au a = al g = au n = none h = class h k = class k ws = waffle pack 100 min., 1 mult 0.004 0.0015 (70, 125) temperature (c) power (mw) - 100 - 50 0 50 100 150 200 120 140 100 80 60 40 20 0 0 1 f anh k 1 ws m sf 0 m 0
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